Antenna in Package Market by Component (Antennas, RF Chip, Power Amplifiers (PA), Low-Noise Amplifiers (LNA), Switches, Filters, and Others), by Process (Double-Side Molding, Selective Molding, and Others), by Frequency Range (<100 GHZ, and Others), by Packaging Technology (Flip Chip Ball Grid Array (FCGBA), and Others), by Application (Mobile Devices, and Others), and by End User (Aerospace & Defense, and Others) – Global Opportunity Analysis and Industry Forecast – 2025–2030
