Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Process (Sawing, Testing, Sorting, and Assembly), by Type of Packaging (Ball Grid Array Packaging, Chip Scale Packaging, Stacked Die Packaging, Multi-chip Packaging, Quad Flat Packaging, Dual In-line Packaging, and Others), and by End-user (Telecommunications, Automotive, Consumer Electronics, Aerospace & Defense, Healthcare & Life Science, Computing & Networking, and Others) – Global Opportunity Analysis and Industry Forecast 2023–2030
