Antenna in Package Market

Antenna in Package Market Overview

The global Antenna in Package (AiP) Market size was valued at USD 36.5 million in 2024 and is predicted to reach USD 261.9 million by 2030 with a CAGR of 32.6%% from 2025-2030.

The market is driven by factors such expansion of mobile communication systems along with the rapidly growing automotive electronics sector and adoption of internet of things. However, high cost and technological challenges hinders the market growth. On the contrary, adoption of miniaturized devices provides ample growth opportunities for the market. Key market players including Powertech Technology Inc. and ASE Technology Holding Co are taking initiatives to maintain their dominance in the industry. These initiatives are paving the way for the industry in the upcoming years.

Expansion of Mobile Communication Drives the Market Growth

The expansion of mobile communication drives the growth of the antenna in package industry by increasing the demand for compact and efficient antenna solutions for supporting advanced wireless technologies and improving the performance of mobile devices. 

As per the latest report published by the Cellular Telecommunications Industry Association 5G connections in the U.S. covers 54% of the total population, leading globally.

South Korea follows with 35%, Netherlands at 34%, Australia at 33%, Thailand at 29%, and China with 27%. As mobile devices become more sophisticated it necessitates the demand for high-impact antennas to support faster data transmission and accommodate higher frequencies required by advanced technologies including 5G.

Rapidly Growing Automotive Electronics Sector Boosts the Market Growth

The rapidly expanding automotive electronics sector boosts the antenna in package market growth by boosting the need for compact antennas to support features including connectivity and autonomous driving technologies in vehicles. The NMSC report stated that the automotive electronics market is projected to reach USD 441.20 billion by 2030. The growth of the automotive electronics market significantly boosts the demand for AiP as miniaturized efficient antennas are needed to enable advanced vehicle functionalities and enhance connectivity solutions.

Adoption of Internet of Things Devices Propels the Market Growth

Increasing use of internet of things devices accelerate the growth of the industry as it spurs the demand for smaller and efficient antennas to enable diverse array of connected devices and applications within smart homes and wearable technologies. 

The report published by the Information Handling Services 2023 the internet of things market increased from 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and is expected to grow by 75.4 billion in 2025. The tremendous rise in global internet of things devices is propelling the market growth as antennas provides dependable connectivity across various internet of things applications.

High Cost and Technical Challenges Hinders the Market Growth

Technical challenges and high costs associated with creation of antenna in package solutions limits the growth of the antenna in package market. Adoption of antennas into semiconductor necessitates sophisticated manufacturing methods and careful design consideration to provide the best performance.

Adoption of Miniaturized Devices Creates Ample Growth Opportunities for the Market

The adoption of miniaturized devices tremendous opportunities in the antenna in package market. This facilitates the creation of efficient and smaller antennas to support upcoming applications in 5G and automotive technologies. 

Moreover, in September 2023, ASE Technology Holding Company limited launched double layer parasitic elements designed for 28 to 39 GHz applications. This technology is designed for the evolving demands of 5G and advanced communication systems where efficient and compact antennas are essential.

Market Segmentation and Scope of the Study

Antenna in package market report is divided on the basis of component, process, frequency range, packaging technology, application, end user and region. On the basis of component, the market is segmented into antennas, RF chip, power amplifiers (PA), low-noise amplifiers (LNA), switches, filters, wireless communication, and power management integrated circuit (PMIC). On the basis of process, the market is divided into double-side molding, selective molding, passive component integration, and electromagnetic interference (EMI). On the basis of frequency range, the market is classified into <100 GHZ, 101-200 GHZ, and 200-300 GHZ. On the basis of packaging technology, the market is bifurcated into flip chip ball grid array (FCGBA), system-in-package (SiP), low-density fan out package, high-density fan out package, and others. On the basis of application, the market is divided into mobile devices, radios and gesture radars, artificial intelligence (AI), autonomous driving, automotive electronics, imaging sensors, internet of things (IoT), and wearable devices. On the basis of end user, the market is divided into aerospace & defense, automotive, consumer electronics, IT & telecommunication, industrial, and others. Regional breakdown and analysis of each of the aforesaid segments includes regions comprising of North America, Europe, Asia-Pacific, and RoW.

Geographical Analysis

Asia-Pacific dominates the antenna in package market share at present and is projected to continue its dominance throughout the forecast period. This is due to the increasing uptake of internet of things devices in the region that necessitates the creation of efficient antenna solutions to address the growing connectivity and data transmission requirements. Based on Korean Ministry of Science and ICT report 2024 South Korea's internet of things industry generated an estimated revenue of approximately USD 18 billion in 2023 marking a 7 percent increase from the previous year. This trend spurs investment and innovation in AiP technology by providing increased connectivity and performance for various internet of things applications ranging from smart home devices to industrial sensors.

Additionally, the increasing automotive sector drives the demand for automotive electronic components that thus stimulates the expansion of the antenna in package industry across the region. With more vehicles featuring sophisticated electronic systems for applications including navigation and autonomous driving there is a rising need for compact and efficient antenna solutions. 

According to the International Trade Administration report 2023 China is the world’s largest vehicle market by both annual sales and manufacturing output and domestic production is expected to reach 35 million vehicles by 2025. This accelerates the adoption of AiP technology that is crucial for improving connectivity and performance in contemporary automotive systems.
On the other hand, North America is considered the fastest growing region in the antenna in package industry. This is due to the rising growth of the mobile communication sector in the region that necessitates the need for advanced and efficient antenna solutions integrated within electronic packages. 

The latest report published by the Cellular Telephone Industries Association in 2023 total 85% of the U.S. population use smartphones and 523 million people accessed wireless connections. These advancement of mobile devices and communication systems in the region increases the need for smaller and more efficient antennas thereby accelerating the growth of this technology.

Furthermore, the growing aerospace and defense sector further fuels the market in the region due to the demand for advanced communication and navigation systems in aerospace and defense applications. According to the latest report by the International Trade Administration Canada committed to invest USD 29 billion towards their defense sector over the period of twenty years in 2022. 

This investment focuses on the modernization of surveillance air weapons systems as well as facilities and support capabilities. The increase in military budgets enable the adoption of sophisticated technology to secure and fast communication that is boosting the market growth. 

Competitive Landscape

Various key market players operating in the AiP industry includes PCB Technologies Ltd., Amkor Technology, ASE Technology Holding Co., Ltd., Powertech Technology Inc., Texas Instruments Incorporate, LitePoint, TMY Technology Inc., Murata Manufacturing Co., Ltd., Insight SiP, MixComm Inc., and others. These market players continue to adopt market development strategies including partnership to maintain their dominance in the antenna in package market.

For instance, in December 2023, Powertech Technology Inc. partnered with Winbond Electronics Corporation to manufacture packaging technologies focusing on 3D packaging solutions.

Key Benefits

• The report provides quantitative analysis and estimations of the antenna in package market from 2025 to 2030, which assists in identifying the prevailing market opportunities.

• The study comprises a deep-dive analysis of the current and future antenna in package market trends to depict prevalent investment pockets in the market.

• Information related to key drivers, restraints, and opportunities and their impact on the antenna in package market is provided in the report.

• Competitive analysis of the key players, along with their market share is provided in the report.

• SWOT analysis and Porters Five Forces model is elaborated in the study.

• Value chain analysis in the market study provides a clear picture of roles of stakeholders

Antenna in Package Market Key Segments

By Component

• Antennas

• RF Chip

• Power Amplifiers (PA)

• Low-Noise Amplifiers (LNA)

• Switches

• Filters

• Wireless Communication

• Power Management Integrated Circuit (PMIC)

By Process

• Double-Side Molding

• Selective Molding

• Passive Component Integration

• Electromagnetic Interference (EMI)

By Frequency Range

• <100 GHZ

• 101-200 GHZ

• 200-300 GHZ

By Packaging Technology

• Flip Chip Ball Grid Array (FCGBA)

• System-in-Package (SiP)

• Low-Density Fan Out Package

• High-Density Fan Out Package

• Others

By Application

• Mobile Devices

• Radios and Gesture Radars

• Artificial Intelligence (AI)

• Autonomous Driving

• Automotive Electronics

• Imaging Sensors

• Internet of Things (IoT)

• Wearable Devices

By End User

• Aerospace & Defense

• Automotive

• Consumer Electronics

• IT & Telecommunication

• Industrial

• Others

By Region

• North America

  • The U.S.

  • Canada

  • Mexico

• Europe

  • The UK

  • Germany

  • France        

  • Italy        

  • Spain        

  • Denmark        

  • Netherlands        

  • Finland        

  • Sweden        

  • Norway        

  • Russia        

  • Rest of Europe    

• Asia-Pacific

  • China

  • Japan

  • India

  • South Korea

  • Australia

  • Indonesia

  • Singapore

  • Taiwan

  • Thailand

  • Rest of Asia Pacific

• RoW

  • Latin America

  • Middle East

  • Africa

Key Players

• PCB Technologies Ltd.

• Amkor Technology

• ASE Technology Holding Co., Ltd.

• Powertech Technology Inc.

• Texas Instruments Incorporate

• LitePoint

• TMY Technology Inc.

• Murata Manufacturing Co., Ltd.

• Insight SiP

• MixComm Inc.

REPORT SCOPE AND SEGMENTATION:

Parameters	Details
Market Size in 2024	USD 36.5 Million
Revenue Forecast in 2030	USD 261.9 Million
Growth Rate	CAGR of 32.6%% from 2024 to 2030
Analysis Period	2024–2030
Base Year Considered	2024
Forecast Period	2025–2030
Market Size Estimation	Million (USD)
Growth Factors	The expansion of mobile communication propels the growth of the industry The rapidly growing automotive electronics industry fuels the expansion of the market The rise in adoption of IoT devices fuels the growth of the AiP industry
Countries Covered	28
Companies Profiled	10
Market Share	Available for 10 companies
Customization Scope	Free customization (equivalent up to 80 working hours of analysts) after purchase. Addition or alteration to country, regional, and segment scope.
Pricing and Purchase Options	Avail customized purchase options to meet your exact research needs.