Pin Fin Heat Sink Market for IGBT

Market Definition

The Global Pin Fin Heat Sink Market for IGBT size was valued at USD 1.51 billion in 2023 and is predicted to reach USD 2.12 billion by 2030, with a CAGR of 5.3% from 2024-2030.

Pin fin heat sinks are heat exchangers designed with several pin-like structures, engineered in fin-based geometry, and are fabricated using metals like copper and aluminum. Heat sink’s function is dissipating the heat produced in the operation of electronic or mechanical devices, and maintaining the internal temperature equilibrium. Benefits offered by pin fin heat sink are increased surface area for heat transfer, enhanced operational efficiency, increased longevity, and higher heat transfer coefficient.

Market Dynamics and Trends

The global pin fin heat sink market for IGBT is on a spur, due to the soaring demand for energy efficient, and low-cost thermal management solutions in the IGBT sector. Also, factors such as increasing penetration of AI and robotics technologies, growing demand of consumer electronics, proliferating automotive sector, and the ever-increasing demand for power supply, are expected to supplement the growth of pin fin heat sink market for IGBT throughout the forecast period.

However, low rate of capacity utilization by the manufacturers are expected to restrain the growth of pin fin heat sink market for IGBT. Moreover, increasing inclination towards hybrid pin fins offering higher efficiency and lower operational cost, and untapped market opportunities offered by the emerging economies like India & China, are projected to augment the growth of the global pin fin heat sink market for IGBT, in coming future.

Market Segmentations and Scope of the Study:

The global market for pin fin heat sinks used in IGBTs has been studied based on the material type, power rating of IGBTs, cooling methods, types of IGBT packages, industries that use them, and geographical regions.

Pin fin heat sinks for IGBTs come in different materials such as Aluminum PIN Fin Heat Sinks, Copper PIN Fin Heat Sinks, and Others. The power rating of IGBTs categorizes them into Low Power (Up to 500A), Medium Power (500A to 1000A), and High Power (Over 1000A). The way these heat sinks are cooled falls into Air-Cooled, Liquid-Cooled, and Hybrid Cooling Systems. IGBTs are packaged as Discrete IGBTs, IGBT Modules, and Intelligent Power Modules (IPMs). Industries using these heat sinks include Automotive, Renewable Energy, Consumer Electronics, Telecommunications, Aerospace and Defense, Healthcare, and Others. The market is studied across regions like Europe, North America, Asia-Pacific, and RoW.

Geographical Analysis

North America demonstrates a mature market, and is expected to grow with a substantial market share in the global pin fin heat sink market for IGBT, throughout the forecast period. This is attributed to advancement in technologies, presence of key players, well-established industrial sector, as well as higher demand for efficient thermal management solutions in this region.

Asia Pacific is expected to demonstrate a tremendous growth, growing with the highest CAGR values in the global pin fin heat sink market for IGBT, throughout the forecast period. The market drivers are majorly; higher population ratios in this region, increase in per-capita disposable incomes, and rapid industrialization leading to increased manufacturing of consumer electronics and automotive, specifically in India and China.

Competitive Landscape

The pin fin heat sink market for IGBT, is highly competitive and consists of various market players. Some of the major market players include Mouser Electronics, Inc., Aavid Thermalloy (Boyd Corporation), Wakefield-Vette, Fischer Elektronik, CUI Devices, Cool Innovations Inc., Sinda Thermal Technology Limited, Ohmite Manufacturing Company (Heico Companies LLC), Simpex Electronic AG and Pioneer Thermal, among others. The key players are employing strategies such as product launches, acquisition, and technical collaboration, in-order to gain stronger position in the pin fin heat sink market for IGBT.

For instance, in July 2019, Boyd Corporation, a pioneer in the pin fin heat sink market for IGBT, announced the acquisition over Lytron Inc., a thermal management company specialized in manufacturing liquid coolants. This acquisition aimed at reinforcing Boyd’s monopoly in manufacturing liquid coolants for end-users like Aerospace industry, Healthcare industry, Electronics & Semiconductors, and other industry verticals; along with technology portfolio expansion in the chiller system solutions.

 

Key Benefits:

• The pin fin heat sink market for IGBT report provides the quantitative analysis of the current market and estimations through 2024-2030 that assists in identifying the prevailing market opportunities to capitalize on.

• The study comprises a deep dive analysis of the pin fin heat sink market for IGBT trend including the current and future trends for depicting the prevalent investment pockets in the market.

• The report provides detailed information related to key drivers, restraints and opportunities and their impact on the pin fin heat sink market for IGBT.

• The report incorporates competitive analysis of the market players along with their market share in the global pin fin heat sink market for IGBT.

• The SWOT analysis and Porters Five Forces model is elaborated in the study of the pin fin heat sink market for IGBT.

• Value chain analysis in the pin fin heat sink market for IGBT study provides a clear picture of the stakeholders’ roles.

Key Market Segments:

By Material Type

• Aluminum PIN Fin Heat Sinks

• Copper PIN Fin Heat Sinks

• Others Material Types

By IGBT Power Rating

• Low Power IGBTs (Up to 500A)

• Medium Power IGBTs ((500A to 1000A)

• High Power IGBTs (Over 1000A)

By Cooling Method

• Air-Cooled PIN Fin Heat Sinks

• Liquid-Cooled PIN Fin Heat Sinks

• Hybrid Cooling Systems

By IGBT Package Type

• Discrete IGBTs

• IGBT Modules

• Intelligent Power Modules (IPMs)

By End-Use Industry

• Automotive

• Renewable Energy

• Consumer Electronics

• Telecommunications

• Aerospace and Defense

• Healthcare

• Others

By Geography

• North America

  • U.S

  • Canada

  • Mexico

• Europe

  • UK        

  • Germany        

  • France        

  • Spain        

  • Italy        

  • Netherlands        

  • Denmark        

  • Finland        

  • Norway        

  • Sweden        

  • Russia        

  • Rest of Europe

• Asia-Pacific

  • China        

  • Japan        

  • India

  • Australia

  • South Korea    

  • Thailand    

  • Singapore

  • Rest of Asia-Pacific    

• RoW

  • Latin America

  • Middle East        

  • Africa

Key Players:

• Mouser Electronics, Inc.

• Aavid Thermalloy (Boyd Corporation)

• Wakefield-Vette

• Fischer Elektronik

• CUI Devices

• Cool Innovations Inc.

• Sinda Thermal Technology Limited

• Ohmite Manufacturing Company (Heico Companies LLC)

• Simpex Electronic AG

• Pioneer Thermal

REPORT SCOPE AND SEGMENTATION:

Parameters	Details
Analysis Period	2023–2030
Base Year Considered	2023
Forecast Period	2024–2030
Market Size Estimation	Billion (USD)
Market Segmentation	By Material Type (Aluminum PIN Fin Heat Sinks, Copper PIN Fin Heat Sinks, Others), by IGBT Power Rating [Low Power IGBTs (Up to 500A), Medium Power IGBTs ((500A to 1000A), High Power IGBTs (Over 1000A)], by Cooling Method (Air-Cooled PIN Fin Heat Sinks, Liquid-Cooled PIN Fin Heat Sinks, Hybrid Cooling Systems), by IGBT Package Type (Discrete IGBTs, IGBT Modules, Intelligent Power Modules (IPMs)], by End-Use (Automotive, Renewable Energy, Consumer Electronics, Telecommunications, Aerospace and Defense, Healthcare, Others)
Geographical Segmentation	North America (U.S., Canada, Mexico) Europe (UK, Germany, France, Spain, Italy, Netherlands, Denmark, Finland, Norway, Sweden, Russia, Rest of Europe), Asia-Pacific (China, Japan, India, Australia, South korea, Singapore, Thailand, Rest of APAC), Rest of the World (Latin America, Middle East, Africa)
Companies Profiled	Mouser Electronics, Inc., Aavid Thermalloy (Boyd Corporation), Wakefield-Vette, Fischer Elektronik, CUI Devices, Cool Innovations Inc., Sinda Thermal Technology Limited, Ohmite Manufacturing Company (Heico Companies LLC), Simpex Electronic AG, and Pioneer Thermal