Outsourced Semiconductor Assembly and Test Services (OSAT) Market by Type (Integrated Device Manufacturers (IDMs), Foundry Service, Water Fabrication, and Design Services), by Process (Sawing, Sorting, Testing, and Assembly), by Packaging Type (Ball Grid Array Packaging, Chip Scale Packaging, Stacked Die Packaging, Multi-Chip Packaging, Quad Flat Packaging, Dual In-Line Packaging, and Other Packaging Types), and by Application (Automotive, Consumer Electronics, Telecommunication, Aerospace and Defense, Medical and Healthcare, Logistics and Transportation, and Other Application) – Global Opportunity Analysis and Industry Forecast 2024–2030
