Advanced Packaging Market for Medical

Market Definition:

The global Advanced Packaging Market size for medical applications was valued at USD 2.99 billion in 2021 and is predicted to reach USD 9.61 billion by 2030, with a CAGR of 13.6% from 2022 to 2030. Advanced packaging technology uses various advanced processes and techniques, which allow multiple electrical components to be aggregated and packaged as a single electronic device.

In the medical sector, advanced packaging is performed to protect the integrated circuits which are made up of many different interconnected components that are used to detect the health condition of an individual.

The medical device packaging technology includes heterogeneous device technologies, biocompatible materials, elimination of cytotoxicity, miniaturization schemes, robust interconnects, and the incorporation of microfluidics and optics. Moreover, advanced packaging technology can deliver substantial space and volume savings for electronic medical devices.

Market Dynamics and Trends

The demand for miniaturized medical devices is increasing in the healthcare sector along with advanced robotic surgery equipment and wearable devices, which is expected to propel the growth of the advanced packaging market in the medical industry.

Also, the growing prevalence of arthritis among the middle-aged and older population is anticipated to increase the adoption of replacement devices, which is expected to propel the growth of the market globally.

Moreover, the rising demand for patient monitoring devices as they can identify small changes in the patient’s physiological and physical condition and alert the user on time. These, along with the introduction of IoT based wireless portable healthcare systems that can continuously monitor patient's heart rate and body temperature increases the demand for advanced packaging for medical applications.

However, the high cost of advanced packaging for medical is expected to restrain the growth of the market during the forecast period. On the other hand, the increasing use of 3D printed devices for the packaging of medical implants and medical instruments for safe transportation is expected to create lucrative opportunities for market players in the future. 

Market Segmentations and Scope of the Study

The global advanced packaging market for medical is segmented into methods, technology, application, and end-users. Based on methods, the market is segmented into wafer-level packaging, system-in-package, chip scale packages, embedded die substrate, bumping & flip-chips packaging, 2.5d & 3d packaging, and others.

Based on technology, the market is classified into bare die package on package (pop), molded laser via pop, embedded die in laminate, FO wafer level package (WLP), silicon interposer/substrate, and through-silicon vias (TSVS), nano packaging, and biomedical packaging based on application, the market is categorized into diagnostic & imaging, medical therapy, patient monitoring, implantation devices, and others.

Based on end-user, the market is divided into hospitals, clinics, and laboratories The geographical breakdown and analysis of each of the aforesaid segments include regions such as North America, Europe, Asia-Pacific, and RoW.

Geographical Analysis

North America region holds the lion's share of the advanced packaging market for medical applications at present and is expected to continue dominating the market during the forecast period. The growing liver diseases in the region due to the high consumption of alcohol and flour-based products increases the demand for robotic surgery equipment, which in turn drives the growth of the market.  For instance, in 2021, Centres for Disease Control and Prevention (CDC) announced that 4.5 million adults were diagnosed with chronic liver disease in the U.S. contributing to 1.8% of the country’s total adult population diagnosed with liver disease.

Also, the rise in the prevalence of coronary artery diseases, hypertension, or heart failure that needs surgical aortic treatment and heart implantation devices drives the growth of the market. According to the Centers for Disease Control and Prevention, heart disease is the leading cause of death for men, women, and people of most racial and ethnic groups in the United States. Also, about 20.1 million adults aged under 20 and older have coronary artery diseases, which in turn drives the growth of the market.

On the other hand, Asia-Pacific is expected to show a steady rise in the advanced packaging market for medical owing to rising cases of high blood pressure in the region that allow patients to use the BP machines at home in turn increases the demand for medical electronics that will further drives the growth of the market. Moreover, the rising demand for medical electronics in the region due to growing diseases including diabetes and tuberculosis drives the growth of the market.

According to the American Diabetes Association, more than 60% of the people with diabetes live in Asia, with almost one-half in China and India combined. The Western Pacific, the world’s most populous region, has more than 138.2 million people with diabetes, and the number may rise to 201.8 million by 2035.

Competitive Landscape

Various market players operating in the global advanced packaging industry for medical include Dupont, 3M, Amcor, Advanced Semiconductor Engineering, Inc., West Pharmaceutical Services, Oliver Healthcare Packaging LLC, Amkor Technology,  UTAC Group, Orient Semiconductor Electronics Ltd, and Medical Packaging Inc., LLC.

For instance, in September 2022, DuPont launched a new brand, Micromax, that will encompass the products formerly under the Microcircuit and Component Materials brand. Micromax brand products are utilized for circuitry, interconnection, and packaging of electronic devices in automotive, passive components, telecom, consumer electronics, and healthcare industries.

Also, in January 2019, Oliver Healthcare Packaging, a leading supplier of sterile barrier flexible packaging to the global healthcare market, announced the acquisition of CleanCut Technologies, a medical packaging provider based in Anaheim, California. As a part of this agreement, Oliver acquired design and prototyping, 3D printing, tube flaring, pad printing, and contract packaging segments.

Key Benefits

• The advanced packaging market for medical report provides a quantitative analysis of the current market and estimations from 2022 to 2030. This analysis assists in identifying the prevailing market opportunities to capitalize on.

• The study comprises a comprehensive analysis of the advanced packaging market for medical trends including the current and future trends for depicting the prevalent investment pockets in the market.

• The information related to key drivers, restraints, and opportunities and their impact on the advanced packaging market for medical is provided in the report. 

• The competitive analysis of the market players along with their market share in the advanced packaging market for medical is mentioned.

• The SWOT analysis and Porter’s Five Forces model are elaborated in the study.

• The value chain analysis in the market study provides a clear picture of the stakeholders’ roles.

Advance Packing Market for Medical Key Segments

By Method

• Wafer Level Packaging

• System-In-Package

• Chip Scale Packages

• Embedded Die Substrate

• Bumping & Flip-Chips Packaging

• 2.5D & 3D Packaging

• Others

By Technology

• Bare Die Package on Package (PoP)

• Molded Laser via Pop

• Embedded Die in Laminate

• FO Waver Level Package (WLP)

• Silicon Interposer/Substrate

• Through-Silicon Vias (TSVs) 

• Nano Packaging

• Biomedical Packaging 

By Application

• Diagnostic & Imaging

• Medical Therapy

• Patient Monitoring

• Implantation Devices

• Others

By End User

• Hospitals

• Clinics

• Laboratories 

By Geography

• North America

  • U.S.

  • Canada

  • Mexico

• Europe

  • UK

  • Italy

  • Germany

  • Spain

  • Netherlands

  • Rest of Europe

• Asia-Pacific

  • China

  • Japan

  • India

  • Australia

  • South Korea

  • Taiwan

  • Vietnam

  • Rest of Asia Pacific

• RoW

  • Latin America

  • Middle East 

  • Africa

REPORT SCOPE AND SEGMENTATION:

Parameters	Details
Analysis Period	2021–2030
Base Year Considered	2021
Forecast Period	2022–2030
Market Size Estimation	Billion (USD)
Market Segmentation	By Method (Wafer Level Packaging, System-In-Package, Chip Scale Packages, Embedded Die Substrate, Bumping & Flip-Chips Packaging, 2.5D & 3D Packaging, Others) By Technology (Bare Die Package on Package (PoP), Molded Laser via Pop, Embedded Die in Laminate, FO Waver Level Package (WLP), Silicon Interposer/substrate, Through-Silicon Vias (TSVs), Nano Packaging, Biomedical Packaging) By Application (Diagnostic & Imaging, Medical Therapy, Patient Monitoring, Implantation devices, Others) By End- User (Hospitals, Clinics, Laboratories)
Geographical Segmentation	North America (U.S., Canada, Mexico) Europe (Germany, UK, Spain, Italy, Netherlands, Rest of Europe), Asia-Pacific (Australia, China, India, Japan, South Korea, Vietnam, Taiwan, Rest of Asia-Pacific), Rest of the World (Latin America, Middle East, Africa)
Companies Profiled	Dupont, 3M, Amcor, Advanced Semiconductor Engineering, Inc, West pharmaceutical services, Oliver Healthcare Packaging LLC, Amkor Technology,  UTAC Group, Orient Semiconductor Electronics Ltd , and Medical Packaging Inc., LLC.

KEY PLAYERS

• Dupont

• 3M

• Amcor

• Advanced Semiconductor Engineering, Inc

• West Pharmaceutical Services

• Oliver Healthcare Packaging LLC

• Amkor Technology

• UTAC Group

• Orient Semiconductor Electronics Ltd

• Medical Packaging Inc., LLC.